Contract processing services for "electroless UBM plating" and "wafer bumping."
Are you having trouble with the "quality," "lead time," or maintenance of plating equipment for UBM plating?
Kyocera has developed UBM formation technology using electroless plating, cultivated in its own printer device processes, and it supports Ni-Pd-Au. We can provide a comprehensive service from solder bump formation, back grinding, dicing, to taping, so please feel free to contact us when needed. 【Features of Kyocera's Electroless UBM Plating】 ■ Support from a single prototype ■ Realization of shortened lead times (as short as 1 day) ■ Quality assurance through automatic visual inspection of all wafers and terminals ■ Long-term stable supply guaranteed due to in-house device processes ■ Compatible with 4/5/6/8 inch wafers *For more details, please refer to the PDF document or feel free to contact us.
- Company：京セラ プリンティングデバイス事業本部
- Price：Other
